You cannot go anywhere today without seeing devices designed to keep all people in touch with each other. Whether shopping or driving down the road most people you see are either texting or talking to family and friends. All of the electronic devices being used have one thing in common and that thing is circuit boards of varying sizes. One of the specialty machines used to help create these boards is the reflow soldering oven.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The preheating step is first on the list. This process determines a ramp up rate for the amount of heat that can be applied to the boards in question. When heat is applied too fast it can cause thermal shock to the components or boards. Thermal shock can cause cracking of components or boards and solder paste spattering. Conversely, heating too slow causes the flux in the paste to be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
This equipment can be large or small in size. Some of the more compact units are called surface mount technology because they can be seated on bench tops. Others are much larger and can measure over six foot in length. Nearly all of these units supply some means for technicians to monitor what is going on inside while the machine is working. Some provide windows and others allow for computer hook ups with USB outlets.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The preheating step is first on the list. This process determines a ramp up rate for the amount of heat that can be applied to the boards in question. When heat is applied too fast it can cause thermal shock to the components or boards. Thermal shock can cause cracking of components or boards and solder paste spattering. Conversely, heating too slow causes the flux in the paste to be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
This equipment can be large or small in size. Some of the more compact units are called surface mount technology because they can be seated on bench tops. Others are much larger and can measure over six foot in length. Nearly all of these units supply some means for technicians to monitor what is going on inside while the machine is working. Some provide windows and others allow for computer hook ups with USB outlets.
These ovens come in many different sizes. They may range from small units that can be placed on the surface of a bench to units that are longer than six feet. The importance of them is demonstrated everyday in products used to communicate with others as well as for mobile intelligence and gaming. They help to make the world smaller with each new devise they help to create.
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